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BCR25A Datasheet, PDF (4/4 Pages) Mitsubishi Electric Semiconductor – MEDIUM POWER USE NON-INSULATED TYPE, GLASS PASSIVATION TYPE
ALLOWABLE AMBIENT TEMPERATURE
VS. RMS ON-STATE CURRENT
(BCR25B)
160
NATURAL CONVECTION
140 ALL FINS ARE BLACK PAINTED
ALUMINUM AND GREASED
120
100 100 t3.0
100
120 120 t3.0
80
160 160 t4.0
60
40
WITHOUT
20 MICA PLATE
WITH GREASE
0
0 4 8 12 16 20 24 28 32
RMS ON-STATE CURRENT (A)
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR25A, BCR25B
MEDIUM POWER USE
NON-INSULATED TYPE, GLASS PASSIVATION TYPE
BREAKOVER VOLTAGE VS.
JUNCTION TEMPERATURE
160
TYPICAL EXAMPLE
140
120
III QUADRANT
100
I QUADRANT
80
60
40
20
0
0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
COMMUTATION CHARACTERISTICS
3 TYPICAL
2 EXAMPLE
VOLTAGE WAVEFORM
t
102
7
5
3
2
Tj = 125°C
(dv/dt)C VD
IT = 4A, τ = 500µs CURRENT WAVEFORM
VD = 200V, f = 3Hz
IT
(di/dt)C
τ
t
101
7
5
3
2
100
7 I QUADRANT
5
III QUADRANT
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
RATE OF DECAY OF ON-STATE
COMMUTATING CURRENT (A /ms)
GATE TRIGGER CURRENT VS.
GATE CURRENT PULSE WIDTH
3 TYPICAL
2 EXAMPLE
A
6Ω
103 Tj = 25°C 6V
7
5
3
IRGT III
2
IRGT I
IFGT I
102
7
5
3
2
tw
0.1s
101
7
5
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103
GATE CURRENT PULSE WIDTH (µs)
GATE TRIGGER CHARACTERISTICS TEST CIRCUITS
6Ω
6Ω
6V
A
6V
A
V
RG
V
RG
TEST PROCEDURE 1 TEST PROCEDURE 2
6Ω
6V
A
V
RG
TEST PROCEDURE 3
Feb.1999