AA057VG02 Datasheet, PDF (19/22 Pages) Mitsubishi Electric Semiconductor – TECHNICAL SPECIFICATION

10. RELIABILITY TEST CONDITION

(1) Temperature and Humidity
ITEM
HIGH TEMPERATURE
HIGH HUMIDITY OPERATION
HIGH TEMPERATURE OPERATION
LOW TEMPERATURE OPERATION
HIGH TEMPERATURE STORAGE
LOW TEMPERATURE STORAGE
THERMAL SHOCK (NON-OPERATION)

CONDITIONS
40°C, 90%RH, 240
h
(No condensation)
70°C, 240 h
−20°C, 240 h
80°C, 240 h
−30°C, 240 h
BETWEEN −30°C(1 h) and 80°C(1 h),
100 CYCLES
(2) Shock & Vibration

ITEM
CONDITIONS
SHOCK
(NON-OPERATION)
Shock level: 1470m/s² (150G)
Waveform: half sinusoidal wave, 2ms
Number of shocks: one shock input in each direction of three mutually
perpendicular axis for a total of six shock inputs
VIBRATION
(NON-OPERATION)
Vibration level: 9.8m/s² (1.0G)
Waveform: sinusoidal
Frequency range: 5 to 500Hz
Frequency sweep rate: 0.5 octave /min
Duration: one sweep from 5 to 500 Hz in each of three mutually
perpendicular axis(total 3 hours)
(3) Judgment standard
The judgment of the above tests should be made as follow:
Pass: Normal display image, no damage of the display function. (ex. no line defect)
Partial transformation of the module parts should be ignored.
Fail: No display image, damage of the display function. (ex. line defect)


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(19/22)





AA057VG02_02_00