PM75B4LB060 Datasheet, PDF (1/8 Pages) Mitsubishi Electric Semiconductor – INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

PM75B4LB060
APPLICATION
Photo voltaic power conditioner
MITSUBISHI <INTELLIGENT POWER MODULES>
PM75B4LB060
FLAT-BASE TYPE
INSULATED PACKAGE
FEATURE
a) Adopting new 5th generation IGBT (CSTBT^TM) chip, which
performance is improved by 1µm fine rule process.
For example, typical Vce(sat)=1.55V @Tj=125°C
b) Over-temperature protection by detecting Tj of the CSTBT^TM
chips and error output is possible from all each conserva-
tion upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
• 2φ 75A, 600V Current-sense IGBT type inverter
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• UL Recognized Yellow Card No.E80276(N)
File No.E80271
PACKAGE OUTLINES
LABEL
7
19.75
3.25
16
3-2
120
106 ±0.25
66.5
16
16
3-2
3-2
15.25
6-2
Dimensions in mm
17
2-φ5.5
16
MOUNTING HOLES
1.5
3
1
5
9
13
19
2.5
7.75
B
U
V
W
44
44
44
44
19.5
22
23
23
23
98.25
19-s0.5
4-_φ2.5
9.5
Terminal code
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
8. VVP1
9. NC
10. NC
11. NC
12. NC
13. VNC
14. VN1
15. NC
16. UN
17. VN
18. NC
19. Fo
Jun. 2005