BA01303 Datasheet, PDF (1/3 Pages) Mitsubishi Electric Semiconductor – Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module

MITSUBISHI SEMICONDUCTOR <InGaP module>
BA01303
Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module
Specification are subject to change without notice.
DESCRIPTION
BA01303 is a front-end module for triple band
(EGSM900/DCS1800/PCS1900) handheld phone
using InGaP HBT technology.
OUTLINE DRAWING
1
5
FEATURES
Low voltage operation
Vc=3.5V
High output power
Po=33.0dBm(min.) @f=880 - 915MHz
Po=30.0dBm(min.) @f=1710 - 1785MHz
Po=30.0dBm(min.) @f=1850 - 1910MHz
Single voltage operation
Single power control terminal
Band select switch
Tx/Rx select switch
Surface mount package
3 Stage amplifier
50ohms matched
ESD capability >±8kV (@ANT pin)
GPRS class12 compatible
20
16
15
6
10
11
APPLICATION
Triple band(EGSM/DCS/PCS) handheld phone.
Vc12
Power
Vc3
monitor
(DCS/PCS)
Vcont2
Vcont3
Rx Rx
(DCS)(PCS)
100pF
100pF _100pF
1000pF
+1uF
1000pF
+1uF
100pF
Pin
(DCS/PCS)
1000pF
Coupler
Tx/Rx Select
Switch
Filter
Vpc
Band Select
Vband
Switch
1000pF
ANT
Pin
(EGSM)
Coupler
Tx/Rx Select
Switch
Filter
1000pF
+1uF
1000pF
+1uF
100pF
100pF
Vc12 Vc3
Power
monitor
Vcont1
Rx
(EGSM)
(EGSM)
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable ,
but there is always the possibility that trouble may occur with them .Trouble with semiconductors may lead to personal
injury ,fire or property damage . Remember to give due consideration to safety when making your circuit designs ,
with appropriate measures such as (i) placement of substitutive , auxiliary circuits , (ii) use of non-flammable material or
(iii) prevention against any malfunction or mishap .
(1/3)
Jan./2004