XP1058-BD Datasheet, PDF (9/12 Pages) Mimix Broadband – 14.5-16.0 GHz GaAs MMIC Power Amplifier

14.5-16.0 GHz GaAs MMIC
Power Amplifier
January 2010 - Rev 04-Jan-10
P1058-BD
Mechanical Drawing
0.246 0.596 0.946 1.296 1.696 2.146 _2.679
(0.010) (0.023)(0.037)(0.051) (0.067) (0.085)(0.105)
2.500
(0.098)
2
3
4
5
6
7
8
1.250
(0.049)
1
18 17 16 15
14
13 12
0.0
0.0 ^{0.246 0.596 0.946 1.296 1.696 2.146 2.679}
(0.010) (0.023)(0.037)(0.051) (0.067) (0.085)(0.105)
3.367
(0.133)
9
10
1.250
(0.049)
XP1058-BD
11
3.367
(0.133)
4.000
(0.157)
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (Vg4A)
Bond Pad #9 (Vd4A)
Bond Pad #10 (RFout)
Bond Pad #11 (Vd4B)
Bond Pad #12 (Vg4B)
Bond Pad #13 (Vd3B)
Bond Pad #14 (Vg3B)
Bond Pad #15 (Vd2B)
Bond Pad #16 (Vg2B)
Bond Pad #17 (Vd1B)
Bond Pad #18 (Vg1B)
(Note: Engineering designator is 15MPA1039)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.075 +/- 0.010 (0.0033 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
Most DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF and Vg4, Vd3,4 Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 6.2 mg.
Bias Arrangement (See App Notes [1], [2] and [3])
Vg1
Vg2
Vg3
Vg4
Vd4
2
3
4
5
6
7
8
9
RF In 1
10 RF Out
XP1058-BD
18 17 16 15
14
Vd1
Vd2
13 12
Vd3 Vg4
11
Vd4
Layout for reference only – It is recommended to bias output
stage from both sides.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 9 of 12
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
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