XP1070-BD Datasheet, PDF (8/11 Pages) Mimix Broadband – 14.5-17.0 GHz GaAs MMIC

14.5-17.0 GHz GaAs MMIC
Power Amplifier
January 2010 - Rev 04-Jan-10
Mechanical Drawing
4.200
(0.165)
0.128 0.712
(0.005) (0.028)
2
3
1.370
(0.054)
4
2.155 2.424 3.223
(0.085)(0.095) (0.127)
56
7
XP1070-BD
P1070-BD
2.099
(0.083)
1
8
2.099
(0.083)
14
13
12
11 10
9
0.0
0.0 _{0.128 0.712 1.370}
(0.005) (0.028) (0.054)
2.155 2.424 3.223
(0.085) (0.095) (0.127)
4.000
(0.157)
(Note: Engineering designator is 15MPA0964)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.075 +/- 0.010 (0.0033 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
Most DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF and Vd1,3 Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 10.416 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Bias Arrangement (See App Notes [1], [2] and [3])
Vg1
Vg2
Vd3
Vg3
2
3
4
56
7
XP1070-BD
RF In 1
8 RF Out
14
13
12
11 10
9
Vd1
Vd2 Vg3 Vd3
Layout for reference only – It is recommended to bias output stage
from both sides.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 8 of 11
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
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