XP1070-BD Datasheet, PDF (10/11 Pages) Mimix Broadband – 14.5-17.0 GHz GaAs MMIC

14.5-17.0 GHz GaAs MMIC
Power Amplifier
January 2010 - Rev 04-Jan-10
P1070-BD
MTTF Graphs
These numbers were calculated based upon accelerated life test information received from the fabricating foundry and extensive thermal modeling/
finite element analysis done at Mimix Broadband. The values shown here are only to be used as a guideline against the end application requirements
and only represent reliability information under one bias condition. Ultimately bias conditions and resulting power dissipation along with the
practical aspects, i.e. thermal material stack-up, attach method of device placement are the key parts in determining overall reliability for a specific
application, see previous pages. If the data shown below does not meet your reliability requirements or if the bias conditions are not within your
operating limits please contact technical sales for additional information.
1.0E+08
1.0E+07
1.0E+06
1.0E+05
1.0E+04
1.0E+03
1.0E+02
55.0
XP1070-BD Vd=7.5 V, Id1=500 mA
Id2=1000 mA, Id3=2200 mA
65.0
75.0
85.0
95.0
105.0 115.0 125.0
Backplate Temperature (deg C)
1.00E+07
1.00E+06
1.00E+05
1.00E+04
1.00E+03
1.00E+02
1.00E+01
55.0
XP1070-BD Vd=7.5 V, Id1=500 mA
Id2=1000 mA, Id3=2200 mA
65.0
75.0
85.0
95.0 105.0 115.0 125.0
Backplate Temperature (deg C)
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
55.0
XP1070-BD Vd=7.5 V, Id1=500 mA
Id2=1000 mA, Id3=2200 mA
65.0
75.0
85.0
95.0
105.0
115.0
125.0
Backplate Temperature (deg C)
210
200
190
180
170
160
150
140
130
120
110
55.0
XP1070-BD Vd=7.5 V, Id1=500 mA
Id2=1000 mA, Id3=2200 mA
65.0
75.0
85.0
95.0
105.0
115.0 125.0
Backplate Temperature (deg C)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 10 of 11
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
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