CMM1100-BD_10 Datasheet, PDF (7/9 Pages) Mimix Broadband – 2.0-18.0 GHz GaAs MMIC

2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
February 2010 - Rev-05-Feb-10
Mechanical Drawing
1.550
(0.061)
1.460
(0.058)
0.215
(0.009)
23
0.843
(0.033)
4
1.508
(0.059)
5
CMM1100-BD
0.418
1
(0.017)
6
0.418
(0.017)
0.0
0.0
14 13 12 11 10
98 7
0.356 0.599 0.838
(0.014) (0.024) (0.033)
0.484 0.714
(0.019) (0.028)
1.245 1.480
(0.049) (0.058)
1.360 1.600
(0.054) (0.063)
(Note: Engineering designator is M425)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.076 +/- 0.010 (0.003 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond Pads are 0.180 x 0.080 (0.007 x 0.003).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.538 mg
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1a)
Bond Pad #3 (Vg1b)
Bias Arrangement
Vd1,2
Bond Pad #4 (Vd1)
Bond Pad #5 (Vd2)
Bond Pad #6 (RF Out)
Bond Pad #7 (Rs2-9.0 ) Bond Pad #11 (Rs1-29.0 )
Bond Pad #8 (Rs2-12.5 ) Bond Pad #12 (Rs1-29.0 )
Bond Pad #9 (Rs2-12.5 ) Bond Pad #13 (Rs1-16.6 )
Bond Pad #10 (Rs2-Off Chip) Bond Pad #14 (Rs1-Off Chip)
Bypass Capacitors - See App Note [2]
23
4
5
RF In 1
14 13 12 11 10
6 RF Out
98 7
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 7 of 9
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
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