CMM3020-BD_10 Datasheet, PDF (6/8 Pages) Mimix Broadband – 30.0 kHz-20.0 GHz GaAs MMIC

30.0 kHz-20.0 GHz GaAs MMIC
Distributed Amplifier
May 2010 - Rev 08-May-10
Mechanical Drawing
1.150
(0.045)
1.059
2
(0.042)
0.449
1
(0.018)
0.0
0.0
CMM3020-BD
3
0.708
(0.028)
4
0.526
(0.021)
2.420
(0.095)
(Note: Engineering designator is M326)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC and RF Bond Pads vary in size, see DXF layout.
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.73 mg.
Bond Pad #1 (RF In + Vg)
Bond Pad #2 (EXT)
Bond Pad #3 (RF Out + Vd)
Bond Pad #4 (EXT)
Bias Arrangement
Bypass Capacitors - See App Note [2]
2
RF In
(Vg) ¹
3
RF Out
(Vd)
4
RF In
(Vg)
RF Out
(Vd)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 6 of 8
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
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