XP1005-BD Datasheet, PDF (4/7 Pages) Mimix Broadband – 35.0-43.0 GHz GaAs MMIC Power Amplifier

35.0-43.0 GHz GaAs MMIC
Power Amplifier
August 2007 - Rev 10-Aug-07
Mechanical Drawing
1.825
(0.072)
1.163
(0.046)
1.562
(0.062)
1.960
(0.077)
2
3
4
2.362
(0.093)
5
2.764
(0.109)
6
P1005-BD
3.162
(0.125)
7
0.831
(0.033)
1
8
0.478
(0.019)
0.0
0.0
14
1.163
(0.046)
13
1.562
(0.062)
12
1.960
(0.077)
11
2.362
(0.093)
10
2.764
(0.109)
9
3.162 3.526
(0.125) (0.139)
(Note: Engineering designator is 38H4PBA0157)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg3A)
Bond Pad #5 (Vd3A)
Bond Pad #6 (Vg4A)
Bond Pad #7 (Vd4A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd4B)
Bond Pad #10 (Vg4B)
Bond Pad #11 Vd3B)
Bond Pad #12 (Vg3B)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
Bias Arrangement
Vg2,3
Vd2,3
Bypass Capacitors - See App Note [2]
Vg2,3 ^Vd2,3
2
3
4
5
6
7
RF In 1
14
13
12
11
10
Vg1
Vg4
Vd1
8 _{RF Out}
9
Vd4
RF In
Vg1
Vd1
XP1005-BD
Vg4 _Vd4
RF Out
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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