CMM0016-BD_08 Datasheet, PDF (4/6 Pages) Mimix Broadband – 2.0-22.0 GHz GaAs MMIC Power Amplifier

2.0-22.0 GHz GaAs MMIC
Power Amplifier
March 2008 - Rev 04-Mar-08
Mechanical Drawing
1.350
(0.053)
1.879
(0.074)
2
CMM0016-BD
3
0.581
(0.023)
0.973
(0.038)
1
0.0
0.0
654
2.164 2.370
(0.085) (0.093)
2.034 2.274
(0.080) (0.090)
(Note: Engineering designator is M397)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.984 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd)
Bond Pad #3 (RF Out)
Bond Pad #4 (Rs-12.0 )
Bond Pad #5 (Rs-1.5 )
Bond Pad #6 (Rs-6.0 )
Bias Arrangement
Vd
2
Bypass Capacitors - See App Note [2]
RF In 1
3 RF Out
6 54
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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