XP1014-BD Datasheet, PDF (3/5 Pages) Mimix Broadband – 8.5-11.0 GHz GaAs MMIC Power Amplifier

8.5-11.0 GHz GaAs MMIC
Power Amplifier
August 2007 - Rev 03-Aug-07
Mechanical Drawing
1.400
(0.055)
XP1014
Mimix Broadband
I0005129
TNO © 2005
1.962
(0.077)
2.412
(0.095)
2
3
P1014-BD
0.449
(0.018)
1
0.0
0.0
6
5
1.662 1.962
(0.065) (0.077)
4
0.449
(0.018)
3.200
(0.126)
(Note: Engineering designator is I0005129)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.120 x 0.200 (0.005 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.778 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg2)
Bond Pad #6 (Vg1)
Bias Arrangement
Vd1
Vd2
XP1014
Mimix Broadband
I0004966
TNO © 2005
2
3
Bypass Capacitors - See App Note [2]
RF In 1
6
5
4 _{RF Out}
Vg1
Mimix Asia, Inc. (a subsidiary of Mimix Broadband, Inc.)
3F, 3-2 Industry East IX Road, Science-Based Industrial Park • Hsinchu, Taiwan, R.O.C
Tel [phone] • Fax [phone] • mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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