XP1003-BD Datasheet, PDF (3/6 Pages) Mimix Broadband – 27.0-35.0 GHz GaAs MMIC

27.0-35.0 GHz GaAs MMIC
Power Amplifier
April 2007 - Rev 02-Apr-07
Mechanical Drawing
0.957
(0.038)
1.357
(0.053)
1.757 2.157
(0.069) (0.085)
2.757
(0.109)
2.557 2.957
(0.101) (0.116)
2.500
(0.098)
2
3
4
5
678
P1003-BD
0.765
1
(0.030)
9
XP1003-BD
0.677
(0.027)
13
12
11
10
0.0
0.0
0.957 1.357 1.757 2.157
(0.038) (0.053) (0.069) (0.085)
3.400
(0.134)
(Note: Engineering designator is 30H2BA0093)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.253 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd2)
Bias Arrangement
Vd1,2
Vg1,2
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #6 (VOUT1)
VOUT1
VIN
Rin
VOUT2
Bond Pad #7 (VIN)
Bond Pad #8 (VOUT2)
Bond Pad #9 (RF Out)
Bond Pad #10 (Vd4)
Bond Pad #11 (Vg4)
Bond Pad #12 (Vd3)
Bond Pad #13 (Vg3)
2
3
4
5
678
Bypass Capacitors - See App Note [3]
RF In 1
Vg3,4
Vd3,4
9 RF Out
XP1003-BD
13
12
11
10
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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