XP1000 Datasheet, PDF (3/6 Pages) Mimix Broadband – 17.0-24.0 GHz GaAs MMIC Power Amplifier

17.0-24.0 GHz GaAs MMIC
Power Amplifier
May 2005 - Rev 05-May-05
Mechanical Drawing
0.467
(0.018)
2.500
(0.099)
2
0.866
(0.034)
3
1.267
(0.050)
4
1.867
(0.074)
5
1.791
1
(0.071)
P1000
P1000
6
2.184
(0.086)
13
12
11
10
0.0
987
0.467
0.866
1.267
0.0
(0.018) (0.034) (0.050)
1.867
(0.074)
2.967 3.368
(0.117) (0.133)
(Note: Engineering designator is 21PAMP_05B) ^{3.167 3.560}
(0.125) (0.140)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.003 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.524 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #6 (RF Out)
Bond Pad #7 (V2 Out)
Bond Pad #8 (Vd5)
Bond Pad #9 (V1 Out)
Bond Pad #10 (Vd4)
Bond Pad #11 (Vg4)
Bond Pad #12 (Vd3)
Bond Pad #13 (Vg3)
Bias Arrangement
Vg1,2
Vd1,2
Bypass Capacitors - See App Note [3]
Vd1,2
Vg1,2
2
3
4
5
1
RF In
P1000
6
RF Out
RF In
XP1000
RF Out
V2 Out
Vg3,4
13
12
11
10
987
V2 Out
Vd3,4
Vd5
Rd
V1 Out
Vd5
Vg3,4 Vd3,4 ^{V1 Out}
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. 2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purcha^©sing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.