CMM0618-BD_07 Datasheet, PDF (3/5 Pages) Mimix Broadband – 6.0-18.0 GHz GaAs MMIC Power Amplifier

6.0-18.0 GHz GaAs MMIC
Power Amplifier
August 2007 - Rev 30-Aug-07
Mechanical Drawing
1.980
(0.078)
0.674
(0.027)
2
1.531 1.781
(0.060) (0.070)
3
4
2.650
(0.104)
5
CMM0618-BD
1.023
(0.040)
1
6
1.023
(0.040)
0.0
0.0
10
0.674
(0.027)
9
8
1.531 1.781
(0.060) (0.070)
7
2.650 2.815
(0.104) (0.111)
(Note: Engineering designator is M400)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Gate DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF/Drain DC Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.455 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2 Bypass)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg1 Bypass)
Bond Pad #5 (Vd1)
Bond Pad #6 (RF Out)
Bond Pad #7 (Vd1 Bypass)
Bond Pad #8 (Vg1)
Bond Pad #9 (Vd2 Bypass)
Bond Pad #10 (Vg2)
Bias Arrangement
Vd2
Vd1
Bypass Capacitors - See App Note [2]
2
3
4
5
RF In 1
6 _{RF Out}
10
Vg2
9
8
7
Vg1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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