20DBL0629 Datasheet, PDF (3/6 Pages) Mimix Broadband – 18.0-21.0/36.0-42.0 GHz GaAs MMIC Doubler and Power Amplifier

18.0-21.0/36.0-42.0 GHz GaAs MMIC
Doubler and Power Amplifier
September 2005 - Rev 01-Sep-05
Mechanical Drawing
0.295
(0.012)
1.700
(0.067)
2
0.694
(0.027)
3
1.095
(0.043)
4
1.494
(0.059)
5
2.096
(0.083)
6
20DBL0629
2.705
(0.107)
7
0.605
1
(0.024)
8
0.638
(0.025)
0.0
0.0
14
0.295
(0.012)
13
12
11
10
9
0.695
1.095
1.495
2.096
2.503
(0.027)
(0.043)
(0.059)
(0.083)
(0.099)
(Note: Engineering designator is 20DBL0629)
3.000
(0.118)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (Vd4)
Bond Pad #6 (Vd5)
Bond Pad #7 (Vd6)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vg6)
Bond Pad #10 (Vg5)
Bond Pad #11 Vg4)
Bond Pad #12 (Vg3)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
Bias Arrangement
Vd2
Vg2
2
3
4
5
Vd3,4,5
Vd6
6
7
Bypass Capacitors - See App Note [2]
RF In 1
8 _{RF Out}
14
13
12
11
10
9
Vg1
Vd1
Vg6
Vg3,4,5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.