FFP30S60S Datasheet, PDF (2/3 Pages) Fairchild Semiconductor – STEALTH II Rectifier

Ordering Guide
Part Number
Format
Detail / Drawing
FFP30S60SMW
Un-sawn wafer, electrical rejects inked
Page 2
FFP30S60SMF
Sawn wafer on film-frame
Page 3
FFP30S60SMD
Singulated die / chips in waffle pack
Page 3
Note: Singulated Die / Chips can also be supplied in Pocket Tape or SurfTape® on request
Die Drawing – Dimensions in µm
40
3708
3251
Passivated area
3251
ANODE
3708
Mechanical Data
Chip backside is CATHODE
Parameter
Chip Dimensions Un-sawn
Chip Thickness (Nominal)
Anode Pad Size
Wafer Diameter
Saw Street
Wafer orientation on frame
Topside Metallisation & Thickness
Backside Metallisation & Thickness
Topside Passivation
Recommended Die Attach Material
Recommended Wire Bond - Anode
3708 x 3708
250
3251 x 3251
127 (subject to change)
80 (subject to change)
Wafer notch parallel with frame flat
Al
6
V/Ni/Ag
0.3
Silicon Nitride
Soft Solder or Conductive Epoxy
Al 380µm X2
Units
µm
µm
µm
mm
µm
µm
µm
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