MYXX28HC256 Datasheet, PDF (18/23 Pages) Micross Components – No External High Voltages or VPP

Packaging Information (continued)
Figure 21 - 32-Pad Ceramic Leadless Chip Carrier Package Type ECA
256Kb EEPROM
MYXX28HC256
0.015 (0.38)
0.003 (0.08)
0.150 (3.81) BSC
0.020 (0.51) x 45° REF.
PIN 1
0.200 (5.08)
BSC
0.095 (2.41)
0.075 (1.91)
0.022 (0.56)
0.006 (0.15)
0.055 (1.39)
0.045 (1.14)
TYP. (4) PLCS.
0.028 (0.71)
0.022 (0.56)
(32) PLCS.
0.050 (1.27) BSC
0.458 (11.63)
0.442 (11.22)
0.458 (11.63)
––
0.300 (7.62)
BSC
0.040 (1.02) x 45° REF.
TYP. (3) PLCS.
0.120 (3.05)
0.060 (1.52)
0.560 (14.22)
0.540 (13.71)
0.400 (10.16)
BSC
0.558 (14.17)
––
0.088 (2.24)
0.050 (1.27)
MYXX28HC256
Revision 1.4 - 02/13
32 1
PIN 1 INDEX CORDER
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. TOLERANCE: ±1% NTL ±0.005 (0.127)
3926 FHD F14
3926 Fhd F14
18