JANS1N5811US Datasheet, PDF (6/7 Pages) Microsemi Corporation – VOIDLESS - HERMETICALLY- SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS

6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / [phone] / Fax: [phone]
Website: http://www.microsemi.com
TECHNICAL DATA SHEET
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: [phone] Fax: [phone]
PACKAGE DIMENSIONS
Dimensions
Ltr
1N5807US,
1N5809US, 1N5811US
Notes
Inches
Millimeters
Min Max Min Max
BD .137 .148 3.84 3.76
BL .200 .225 5.08 5.72
ECT .019 .028 0.48 0.71
S .003
0.08
PAD LAYOUT
INCHES
mm
A
0.288
7.32
B
0.070
1.78
C
0.155
3.94
Note: If mounting requires
adhesive separate from the
solder, an additional 0.080 inch
diameter contact may be placed
in the center between the pads as
an optional spot for cement.
NOTE 1:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Minimum clearance of glass body to mounting surface on all orientations.
5. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab.
6. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie
within .020 inch (0.51 mm) of the mounting surface.
7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
NOTE 2: This Package Outline has also previously been identified as “D-5B”
FIGURE 2A. Physical dimensions of US surface mount family
T4-LDS-0168 Rev. 2 (111089)
Page 6 of 7