JANS1N5811US Datasheet, PDF (2/7 Pages) Microsemi Corporation – VOIDLESS - HERMETICALLY- SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS

TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / [phone] / Fax: [phone]
Website: http://www.microsemi.com
Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.
Tel: [phone] Fax: [phone]
APPLICATIONS / BENEFITS
 Ultrafast recovery 6 Amp rectifier series 50 to 150V
 Military Space and other high-reliability applications
 Switching power supplies or other applications requiring extremely fast switching & low forward loss
 High forward surge current capability
 Low thermal resistance
 Controlled avalanche with peak reverse power capability
 Inherently radiation hard as described in Microsemi MicroNote 050
MAXIMUM RATINGS
 Junction Temperature: -65^oC to +175^oC
 Storage Temperature: -65^oC to +175^oC
 Average Rectified Forward Current (I_O): 6 A @ T_L = 75ºC at 3/8 inch lead length (see note 1)
 Thermal Resistance: 22 ºC/W junction to lead (L=.375 in)
 Thermal Impedance: 1.5 ºC/W @ 10 ms heating time
 Forward Surge Current (8.3 ms half sine) 125 Amps
 Capacitance: 60 pF at 10 volts, f = 1 MHz
 Solder temperature: 260ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
 CASE: Hermetically sealed voidless hard glass with Tungsten slugs
 TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb) over Ni plate over Copper.
 MARKING: Body painted and part number, etc.
 POLARITY: Cathode indicated by band
 Tape & Reel option: Standard per EIA-296
 Weight: 750 mg
 See package dimensions on last page
T4-LDS-0168 Rev. 2 (111089)
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