JAN1N6461 Datasheet, PDF (6/6 Pages) Microsemi Corporation – Voidless Hermetically Sealed Unidirectional Voidless Hermetically Sealed Unidirectional

1N6461US – 1N6468US
PACKAGE DIMENSIONS
Inch
Min Max
BL 0.137 0.148
BD 0.200 0.225
ECT 0.019 0.028
S 0.003 ---
Millimeters
Min Max
3.48 3.76
5.08 5.72
0.48 0.71
0.08 ---
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for information only.
3. Referencing to dimension S, minimum clearance of glass body to mounting surface on all orientations.
4. Dimensions are pre-solider dip.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
PAD LAYOUT
INCH
MILLIMETERS
A
0.288
7.32
B
0.070
1.78
C
0.155
3.94
Note: If mounting requires adhesive
separate from the solder, an additional
0.080 inch diameter contact may be placed
in the center between the pads
as an optional spot for cement.
T4-LDS-0286-1, Rev. 1 (4/22/13)
©2013 Microsemi Corporation
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