English
Language : 

APT30GS60BRDL Datasheet, PDF (5/9 Pages) Microsemi Corporation – Resonant Mode Combi IGBT
TYPICAL PERFORMANCE CURVES
200
100
ICM
200
100
ICM
APT30GS60BRDL(G)
10
VCE(on) 13µs
100µs
1ms
1
10ms
100ms
DC line
TJ = 125°C
TC = 75°C
0.1
1
10
100
800
VCE, COLLECTOR-TO-EMITTER VOLTAGE (V)
Figure 17, Forward Safe Operating Area
10
VCE(on) 13µs
100µs
1ms
1
TJ = 150°C
TC = 25°C
10ms
100ms
DC line
Scaling for Different Case & Junction
Temperatures:
0.1
IC = IC(TC = 25°C)*(TJ - TC)/125
1
10
100
800
VCE, COLLECTOR-TO-EMITTER VOLTAGE (V)
Figure 18, Maximum Forward Safe Operating Area
0.60
0.50
0.40
0.30
0.20
0.10
0
10-5
0.9
0.7
0.5
Note:
0.3
0.1
0.05
SINGLE PULSE
t1
t2
Duty Factor D = t1/t2
Peak TJ = PDM x ZθJC + TC
10-4
10-3
10-2
10-1
1.0
RECTANGULAR PULSE DURATION (SECONDS)
Figure 19, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration
TJ (°C)
TC (°C)
Dissipated Power
(Watts)
0.0838
0.207
0.209
0.00245
0.00548
0.165
ZEXT are the external thermal
impedances: Case to sink,
sink to ambient, etc. Set to
zero when modeling only
the case to junction.
Figure 20, Transient Thermal Impedance Model
120
TC = 75°C
TC = 100°C
10
F
max
=
min
(fmax,
f
max2)
0.05
fmax1 = t d(on) + tr + td(off) + tf
TJ = 125°C
TC = 75°C
D = 50 %
VCE = 400V
1 RG = 9.1Ω
fmax2 =
Pdiss - P cond
E on2 + E off
Pdiss =
TJ - T C
R θJC
0
10
20
30
40
50
IC, COLLECTOR CURRENT (A)
Figure 21, Operating Frequency vs Collector Current