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APT50GT120JU2 Datasheet, PDF (3/7 Pages) Microsemi Corporation – Boost chopper Trench + Field Stop IGBT
APT50GT120JU2
Chopper diode ratings and characteristics
Symbol Characteristic
Test Conditions
Min Typ Max Unit
VF Diode Forward Voltage
IF = 30A
IF = 60A
IF = 30A
Tj = 125°C
IRM Maximum Reverse Leakage Current
VR = 1200V
VR = 1200V
Tj = 25°C
Tj = 125°C
CT Junction Capacitance
VR = 200V
Reverse Recovery Time
trr
Reverse Recovery Time
IF=1A,VR=30V
di/dt =100A/µs
Tj = 25°C
Tj = 25°C
Tj = 125°C
IRRM
Maximum Reverse Recovery Current
IF = 30A
VR = 800V
di/dt =200A/µs
Tj = 25°C
Tj = 125°C
Qrr Reverse Recovery Charge
Tj = 25°C
Tj = 125°C
2.0 2.5
2.3
V
1.8
250
500
µA
32
pF
31
370
ns
500
5
A
12
660
nC
3450
trr Reverse Recovery Time
IF = 30A
220
ns
Qrr Reverse Recovery Charge
VR = 800V
Tj = 125°C
4650
nC
IRRM Maximum Reverse Recovery Current di/dt =1000A/µs
37
A
Thermal and package characteristics
Symbol Characteristic
Min Typ Max Unit
RthJC Junction to Case Thermal Resistance
IGBT
Diode
0.36
1.1 °C/W
RthJA
VISOL
TJ,TSTG
TL
Torque
Junction to Ambient (IGBT & Diode)
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
2500
-55
20
V
150
300
°C
1.5 N.m
Wt Package Weight
29.2
g
Typical IGBT Performance Curve
Operating Frequency vs Collector Current
60
50
V CE=600V
D=50%
R =18 Ω
40
G
TJ =125°C
30
20
10
0
0 10 20 30 40 50 60 70 80
IC (A)
www.microsemi.com
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