CHFP6KE50 Datasheet, PDF (2/3 Pages) Microsemi Corporation – Patented Flip-Chip Series

PEAK PULSE POWER Vs PULSE TIME
CHFP6KE5.0 thru CHFP6KE170CA
PEAK PULSE
POWER DERATING
TP – PULSE TIME – SEC
TEMPERATURE °C
ATTACHMENT AND CONFORMAL COATING
INSTRUCTIONS
FOR Flip-Chip COMPONENTS
The .010” thick tab standoffs minimize shorting during attachment; however, minimal
solder/conductive epoxy must be used and carefully controlled to prevent excess
attachment material from wicking up the side of the tab and shorting across the junction.
Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for
vapor-phase reflow. For flip-chip protection, coating material is Stycast ™ 2651-40 low-
viscosity epoxy manufactured by Emerson & Cuming. Follow instructions carefully for
preparation of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips
have been baked at 100 C for 15 minutes minimum to out-gas any adsorbed moisture
immediately prior to coating. Epoxy-coating material should be dispensed around the
edges of the chip with an appropriately sized syringe after which epoxy is de-aired to
remove bubbles entrapped beneath the chip. Cure epoxy as instructed by the supplier.
MSC1596.PDF
ISO 9001 CERTIFIED
REV B 3/13/2000