CHFP6KE50 Datasheet, PDF (1/3 Pages) Microsemi Corporation – Patented Flip-Chip Series

8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: [phone]
Fax: [phone]
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• Unidirectional and Bidirectional
• Fully glass passivated
• 600 watt (10/1000 µs)
• Eliminates wire bonding
• NON Inductive Insertion
• No voltage overshoot
MECHANICAL
• Weight: 0.01 grams (approximate)
• Solderable standoff tabs .040X.040X.010
PACKAGING
• Waffle package 50 pices or wafer ring 70 pieces
Patented Flip-Chip Series
MAXIMUM RATINGS
• Max Junction Temperature: 150⁰C (with conformal coating)
• Storage Temperature: -55⁰C to +150⁰C
• Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µs)
• Maximum non-repetitive peak power 600 Watts (10/1000 µs)
• Total continuous power dissipation 2.5 W (with adequate heat
sink @ 75⁰C)
• Turn-on time (theoretical) unidirectional 1X10^-12
• Turn-on time (theoretical) bidirectional 1X10^-9
BIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
FLIP-CHIP DIMENSIONS
PAD SIZE & CIRCUIT
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
FLIP-CHIP DIMENSIONS
PAD SIZE & CIRCUIT
MSC1596.PDF
VBR above 30 V
VBR 30V and below
ISO 9001 CERTIFIED
REV B 3/13/2000