ARF1510 Datasheet, PDF (2/2 Pages) Advanced Power Technology – RF POWER MOSFET

DYNAMIC CHARACTERISTICS
Symbol Characteristic
C_iss
C_oss
C_rss
t_d(on)
t_r
t_d(off)
t_f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V_GS = 0V
V_DS = 200V
f = 1 MHz
V_GS = 15V
V_DD = 500V
I_D = 6.5A @ 25°C
R_G = 1.6Ω
ARF1510
MIN TYP MAX UNIT
1200 1800
100 130 pF
20
26
8
5
ns
18
10
FUNCTIONAL CHARACTERISTICS
Symbol Characteristic
Test Conditions
MIN TYP MAX UNIT
G_PS Common Source Amplifier Power Gain
η
Drain Efficiency
Ψ
Electrical Ruggedness VSWR 6:1
f = 40.7 MHz
V_GS = 0V V_DD = 400V
P_out = 750W
13
15
dB
75
%
No Degradation in Output Power
1 _{Pulse Test: Pulse width < 380 μS, Duty Cycle < 2%.}
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
D1
1.065"
27.05 mm
G1
S1D2
G2
S2
.300
ARF1510
1.065"
27.05 mm
D3
G3
S3D4
G4
S4
.300
.100
.175
.100
.075
.100
.175
.100
.075
.100
.254
.045 .005
ARF 1510
Heat Sink
Clamp
D1
D3
G1
G3
S1D2
S3D4
G2
G4
S2
S4
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the device
between leads and mounting surface
is beryllium oxide, BeO. Beryllium
oxide dust is toxic when inhaled.
Care must be taken during handling
and mounting to avoid damage to
this area. These devices must never
be thrown away with general industri-
al or domestic waste.
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available
when the package mounting surface is at 25°C and the
junction temperature is 175°C. The thermal resis-
tance between junctions and case mounting surface
is 0.10°C/W. When installed, an additional thermal
impedance of 0.06°C/W between the package base and
the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small
surface irregularities. The heatsink should incorporate a
copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A
clamped joint maintains the required mounting pressure
while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, and two 6-32 (M3.5)
screws can provide the minimum 125 lb. required
mounting force. T=4-6 in-lb. Please refer to App Note
1802 "Mounting Instructions for Flangeless Packages."