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APT36GA60B Datasheet, PDF (2/6 Pages) Microsemi Corporation – High Speed PT IGBT
Dynamic Characteristics
TJ = 25°C unless otherwise specified
APT36GA60B
Symbol Parameter
Test Conditions
Min Typ Max Unit
Cies
Input Capacitance
Capacitance
2880
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VGE = 0V, VCE = 25V
f = 1MHz
226
pF
328
Qg
Total Gate Charge
Gate Charge
102
Qge
Gate-Emitter Charge
VGE = 15V
18
Qgc
Gate- Collector Charge
VCE= 300V
IC = 20A
nC
34
SSOA
Switching Safe Operating Area
TJ = 150°C, RG = 10Ω4, VGE = 15V,
109
A
L= 100uH, VCE = 600V
td(on)
Turn-On Delay Time
Inductive Switching (25°C)
16
tr
Current Rise Time
td(off)
Turn-Off Delay Time
tf
Current Fall Time
Eon2
Turn-On Switching Energy
E6
off
Turn-Off Switching Energy
VCC = 400V
VGE = 15V
IC = 20A
RG = 10Ω4
TJ = +25°C
14
ns
122
77
307
μJ
254
td(on
Turn-On Delay Time
Inductive Switching (125°C)
14
tr
Current Rise Time
td(off)
Turn-Off Delay Time
VCC = 400V
VGE = 15V
15
ns
149
tf
Current Fall Time
Eon2
Turn-On Switching Energy
E6
off
Turn-Off Switching Energy
IC = 20A
RG = 10Ω4
TJ = +125°C
113
508
μJ
439
1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.
2 Pulse test: Pulse Width < 380μs, duty cycle < 2%.
3 See Mil-Std-750 Method 3471
4 RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)
5 Eon2 is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the IGBT turn on energy loss. A combi device is used for the
clamping diode.
6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1.
Microsemi reserves the right to change, without notice, the specifications and information contained herein.