A3P060-VQG100 Datasheet, PDF (15/27 Pages) Microsemi Corporation – Terrestrial FPGA and SoC Product Catalog

FPGA Packages
Key: f – family bs – package body size excluding leads p s – overall package dimensions including package leads h – package thickness p – pin pitch / ball pitch
FG896
f IGLOOe¹
ProASIC3E¹
ProASIC3L¹
Military
ProASIC3/EL¹
ps 31x31 mm
h 2.23 mm
p 1.00 mm
FG676
f ProASIC3E¹
Fusion¹
ps 27x27 mm
h 2.23 mm
p 1.00 mm
FG484
f SmartFusion
Fusion^{1, 3}
IGLOO¹
IGLOOe¹
ProASIC3^{1, 2}
ProASIC3E^{1, 2}
ProASIC3L¹
Military
ProASIC3/EL¹
ps 23x23 mm
h 2.23 mm
p 1.00 mm
FG324
f ProASIC3E¹
ProASIC3L¹
ps 19x19 mm
h 1.63 mm
p 1.00 mm
FG256
f SmartFusion
Fusion^{1, 3, 4}
IGLOO¹
IGLOOe
ProASIC3^{1, 2}
ProASIC3E ²
ProASIC3L¹
ps 17x17 mm
h 1.60 mm
p 1.00 mm
FG144
f IGLOO¹
ProASIC3¹
ProASIC3L¹
Military
ProASIC3/EL¹
ps 13x13 mm
h 1.45 mm
p 1.00 mm
CS289
f IGLOO PLUS
ps 14x14 mm
h 1.20 mm
p 0.80 mm
CS288
f SmartFusion
ps 11x11 mm
h 1.05 mm
p 0.50 mm
CS281
f IGLOO¹
IGLOO PLUS
ps 10x10 mm
h 1.05 mm
p 0.50 mm
CS201
f IGLOO PLUS
ps 8x8 mm
h 0.89 mm
p 0.50 mm
CS196
f IGLOO
ps 8x8 mm
h 1.11 mm
p 0.50 mm
CS121
f IGLOO
ProASIC3
ps 6x6 mm
h 0.90 mm
p 0.50 mm
CS81
f IGLOO
IGLOO nano
ps 5x5 mm
h 0.80 mm
p 0.50 mm
UC81
f IGLOO
IGLOO nano
ps 4x4 mm
h 0.80 mm
p 0.40 mm
UC36
f IGLOO nano
ps 3x3 mm
h 0.80 mm
p 0.40 mm
QN180
f Fusion
ps 10x10 mm
h 0.75 mm
p 0.50 mm
QN108
f Fusion
ps 8x8 mm
h 0.75 mm
p 0.50 mm
QN132
f IGLOO
ProASIC3
ps 8x8 mm
h 0.75 mm
p 0.50 mm
QN68
f IGLOO
IGLOO nano
ProASIC3
ProASIC3 nano
ps 8x8 mm
h 0.90 mm
p 0.40 mm
Notes:
1 Includes Cortex-M1 devices.
2 FG256 and FG484 are footprint-compatible for ProASIC3 and ProASIC3E.
3 Pigeon Point devices are only offered in FG484 and FG256.
4 MicroBlade devices are only offered in FG256.
16 www.microsemi.com/soc
QN48
f IGLOO
IGLOO nano
ProASIC3
ProASIC3 nano
ps 6x6 mm
h 0.90 mm
p 0.40 mm