UPS5100E3 Datasheet, PDF (1/5 Pages) Microsemi Corporation – 5 A High Voltage Schottky Barrier Rectifier

UPS5100e3
5 A High Voltage Schottky Barrier Rectifier
DESCRIPTION
This UPS5100e3 in the Powermite3^® package is a high efficiency Schottky
rectifier that is also RoHS compliant offering high current/power capabilities
previously found only in much larger packages. They are ideal for SMD
applications that operate at high frequencies. In addition to its size
advantages, the Powermite3^® package includes a full metallic bottom that
eliminates the possibility of solder flux entrapment during assembly and a
unique locking tab act as an efficient heat path to the heat-sink mounting. Its
innovative design makes this device ideal for use with automatic insertion
equipment.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
V_RRM
Working Peak Reverse Voltage
V_RWM
100
V
DC Blocking Voltage
V_R
RMS Reverse Voltage
V_R(RMS)
70
V
Average Rectified Output Current
I_o
5
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
I_FSM
100
A
on Rated Load@ T_c =90 ºC
Storage Temperature
T_STG
-55 to +150
ºC
Junction Temperature
T_J
-55 to +125
ºC
THERMAL CHARACTERISTICS
Thermal Resistance
Junction-to-Case (bottom)
R_θJC
2.5
ºC/ Watt
Junction to Ambient (1)
R_θJA
65
ºC/ Watt
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print
Powermite 3™
KEY FEATURES
ƒ Very low thermal resistance package
ƒ RoHS Compliant with e3 suffix part number
ƒ Guard-ring-die construction for transient
protection
ƒ Efficient heat path with Integral locking
bottom metal tab
ƒ Low forward voltage
ƒ Full metallic bottom eliminates flux
entrapment
ƒ Compatible with automatic insertion
ƒ Low profile-maximum height of 1mm
APPLICATIONS/BENEFITS
ƒ Switching and Regulating Power Supplies.
ƒ Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
ƒ Elimination of reverse-recovery oscillations
to reduce need for EMI filtering
ƒ Charge Pump Circuits
ƒ Reduces reverse recovery loss with low I_RM
ƒ Small foot print
190 X 260 mils (1:1 Actual size)
See mounting pad details on pg 3
MECHANICAL & PACKAGING
• CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
• FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
• POLARITY: See figure (left)
• MARKING: S5100•
• WEIGHT: 0.072 gram (approx.)
• Package dimension on last page
• Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
Copyright © 2007
10-15-2007 Rev C
Microsemi
Page 1