UPGA301AE3 Datasheet, PDF (1/4 Pages) Microsemi Corporation – Nanosecond SCR SWITCH

SCOTTSDALE DIVISION
UPGA301Ae3
Nanosecond SCR SWITCH
DESCRIPTION
The UPGA301Ae3 is Designed for
high current narrow-pulse switching
applications where size and current
handling capability are critical.
These devices may be triggered on
using low power logic drivers from
(+0.8 V at 200 μA).
Epoxy packaged, oxide passivated planar
SCR chips with metallurgic bonds on both
sides to achieve high reliability. Internal
wire bond connection allows high current
surge capability for narrow pulse
applications.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’swebsite:http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Repetative peak Off-State Voltage
V_DRM
100
V
Peak On-State Current for 50 ns (max)
I_TSM
100
A
Peak Gate Current
I_GM
250
mA
Reverse Gate Voltage
V_GR
5
V
Storage Temperature Range
Ts
-50 to 150
ºC
Operating Temperature Range
T_J
0 to 125
ºC
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction-to-Case (Anode Bottom)
R_θJC
4.0
Junction-to-Ambient (1)
R_θJA
65
ºC/Watt
ºC/Watt
(1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint
Small foot print
.190 X .270 inches
1:1 Actual size
See mounting pad details on pg 3
KEY FEATURES
ƒ Very low thermal resistance package
ƒ Efficient heat path with integral
locking bottom metal tab
ƒ Full metallic bottom eliminates flux
entrapment
ƒ RoHS Compliant with e3 suffix
ƒ High speed switching capability
ƒ Compatible with high-speed insertion
ƒ Low profile height of 1 mm
APPLICATIONS/BENEFITS
ƒ Reference Microsemi MicroNote 601
and 602
ƒ Nanosecond SCR switch for reliable
high current pulse generators,
modulators and photo-flash
quenching
ƒ Logic drive capability (0.8V, 200μA)
ƒ Ideal for Laser Range finder and
Camera Applications
ƒ Ideal for Automotive Collision
Avoidance Applications
MECHANICAL & PACKAGING
• CASE: Void-free transfer molded
thermosetting epoxy compound
meeting UL94V-0
• FINISH: Annealed matte-Tin plating
over copper and readily solderable per
MIL-STD-750 method 2026 (consult
factory for Tin-Lead plating)
• POLARITY: See figure (left)
• MARKING: 301A•
• WEIGHT: 0.072 gram (approx.)
• Package dimensions on last page
• Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
Copyright © 2005
7-17-05, Rev D
Microsemi
8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: [phone]
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