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MT4C1M16C3 Datasheet, PDF (9/22 Pages) Micron Technology – FPM DRAM
NOTES
1. All voltages referenced to VSS.
2. This parameter is sampled. VCC = +3.3V or 5.0V;
f = 1 MHz.
3. ICC is dependent on output loading. Specified
values are obtained with minimum cycle time
and the output open.
4. Enables on-chip refresh and address counters.
5. The minimum specifications are used only to
indicate cycle time at which proper operation
over the full temperature range (0°C ≤ TA ≤ 70°C)
for commercial and (-20°C ≤ TA ≤ 80°C) for
extended “ET” is ensured.
6. An initial pause of 100µs is required after power-
up, followed by eight RAS# refresh cycles (RAS#-
ONLY or CBR), before proper device operation is
ensured. The eight RAS# cycle wake-ups should
be repeated any time the tREF refresh require-
ment is exceeded.
7. AC characteristics assume tT = 5ns.
8. VIH (MIN) and VIL (MAX) are reference levels for
measuring timing of input signals. Transition
times are measured between VIH and VIL (or
between VIL and VIH).
9. In addition to meeting the transition rate
specification, all input signals must transit
between VIH and VIL (or between VIL and VIH) in a
monotonic manner.
10. If CAS# = VIH, data output is High-Z.
11. If CAS# = VIL, data output may contain data from
the last valid READ cycle.
12. Measured with a load equivalent to two TTL
gates, 100pF and VOL = 0.8V and VOH = 2V.
13. If CAS# is LOW at the falling edge of RAS#, Q will
be maintained from the previous cycle. To
initiate a new cycle and clear the Q buffer, CAS#
must be pulsed HIGH for tCP.
14. The tRCD (MAX) limit is no longer specified. tRCD
(MAX) was specified as a reference point only. If
tRCD was greater than the specified tRCD (MAX)
limit, then access time was controlled exclusively
by tCAC (tRAC [MIN] no longer applied). With or
without the tRCD limit, tAA and tCAC must
always be met.
15. The tRAD (MAX) limit is no longer specified. tRAD
(MAX) was specified as a reference point only. If
tRAD was greater than the specified tRAD (MAX)
limit, then access time was controlled exclusively
by tAA (tRAC and tCAC no longer applied). With or
without the tRAD (MAX) limit, tAA, tRAC, and
tCAC must always be met.
16. Either tRCH or tRRH must be satisfied for a READ
cycle.
1 MEG x 16
FPM DRAM
17. tOFF (MAX) defines the time at which the output
achieves the open circuit condition; it is not a
reference to VOH or VOL.
18. tWCS, tRWD, tAWD, and tCWD are restrictive
operating parameters in LATE WRITE and READ-
MODIFY-WRITE cycles only. If tWCS ≥ tWCS
(MIN), the cycle is an EARLY WRITE cycle and the
data out-put will remain an open circuit through-
out the entire cycle. If tRWD ≥ tRWD (MIN),
tAWD ≥ tAWD (MIN) and tCWD ≥ tCWD (MIN),
the cycle is a READ WRITE and the data output
will contain data read from the selected cell. If
neither of the above conditions is met, the state
of Q (at access time and until CAS# or OE# goes
back to VIH) is indeterminate. OE# held HIGH and
WE# taken LOW after CAS# goes LOW result in a
LATE WRITE (OE#-controlled) cycle.
19. These parameters are referenced to CAS# leading
edge in EARLY WRITE cycles and WE# leading
edge in LATE WRITE or READ-MODIFY-WRITE
cycles.
20. During a READ cycle, if OE# is LOW then taken
HIGH before CAS# goes HIGH, Q goes open. If
OE# is tied permanently LOW, LATE WRITE and
READ-MODIFY-WRITE operations are not
permissible and should not be attempted.
21. A HIDDEN REFRESH may also be performed
after a WRITE cycle. In this case, WE# = LOW and
OE# = HIGH.
22. All other inputs at 0.2V or VCC - 0.2V.
23. Column address changed once each cycle.
24. LATE WRITE and READ-MODIFY-WRITE cycles
must have both tOD and tOEH met (OE# HIGH
during WRITE cycle) in order to ensure that the
output buffers will be open during the WRITE
cycle. The DQs will provide the previously read
data if CAS# remains LOW and OE# is taken back
LOW after tOEH is met. If CAS# goes HIGH prior
to OE# going back LOW, the DQs will remain
open.
25. The DQs open during READ cycles once tOD or
tOFF occur.
26. The 3ns minimum is a parameter guaranteed by
design.
27. The first CASx edge to transition LOW.
28. The last CASx edge to transition HIGH.
29. Output parameter (DQx) is referenced to
corresponding CAS# input; DQ0-DQ7 by CASL#
and DQ8-DQ15 by CASH#.
30. Last falling CASx edge to first rising CASx edge.
31. Last rising CASx edge to next cycle’s last rising
CASx edge.
1 Meg x 16 FPM DRAM
D51_5V_B.p65 – Rev. B; Pub 3/01
9
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.