MT48H32M16LF Datasheet, PDF (72/73 Pages) Micron Technology – 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM

512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Package Dimensions
Package Dimensions
Figure 55: 54-Ball VFBGA (10mm x 11.5mm)
0.65 ±0.05
Seating
plane
0.1 A
A
54X Ø0.45
Dimensions
apply to solder
balls post reflow.
Pre-reflow balls
are Ø0.42 on
Ø0.40 SMD ball
pads.
3.2
6.4
0.8 TYP
10 ±0.10
5 ±0.05
98 7
321
Ball A1 ID
A _{5.75 ±0.05}
B
C
D
E
11.5 ±0.1
F
G
H
J
Solder ball material:
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
Ball A1 ID
0.8 TYP
3.2
6.4
1.0 MAX
Notes: 1. All dimensions are in millimeters.
2. Green packaging composition is available upon request.
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
72
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