MT18VDVF12872DG Datasheet, PDF (31/38 Pages) Micron Technology – DDR SDRAM VLP Registered DIMM

512MB, 1GB: (x72, DR) 184-Pin DDR VLP RDIMM
Temperature and Air Flow Specifications
Temperature and Air Flow Specifications
Figure 11: Component Case Temperature vs. Air Flow
100
90
T_max- memory stress software
80
Ambient Temperature = 25º C
70
T_ave- memory stress software
60
50
T_ave- 3D gaming software
40
30
Minimum Air Flow
20
Air Flow (meters/sec)
Notes: 1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM)
across all modules.
2. The component case temperature measurements shown above were obtained experimen-
tally. The typical system to be used for experimental purposes is a dual-processor 600 MHz
work station, fully loaded, with four comparable registered memory modules. Case tem-
peratures charted represent worst-case component locations on modules installed in the
internal slots of the system.
3. Temperature versus air speed data is obtained by performing experiments with the system
motherboard removed from its case and mounted in a Eiffel-type low air speed wind tun-
nel. Peripheral devices installed on the system motherboard for testing are the proces-
sor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel
test chamber.
4. The memory diagnostic software used for determining worst-case component tempera-
tures is a memory diagnostic software application developed for internal use by Micron
Technology, Inc.
PDF: 09005aef81c73825/Source: 09005aef81c73837
DVF18C64_128x72D_2.fm - Rev. A 8/05 EN
31
Micron Technology, Inc., reserves the right to change products or specifications without notice.
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