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MT18VDDF6472DG Datasheet, PDF (22/31 Pages) Micron Technology – DDR SDRAM REGISTERED DIMM
512MB, 1GB (x72, ECC, SR) PC3200
184-PIN DDR SDRAM RDIMM
Table 15: PLL Clock Driver Timing Requirements and Switching Characteristics
Note: 1
PARAMETER
Operating Clock Frequency
Input Duty Cycle
Stabilization Time
Cycle to Cycle Jitter
Static Phase Offset
Output Clock Skew
Period Jitter
Half-Period Jitter
Input Clock Slew Rate
Output Clock Slew Rate
SYMBOL
fCK
tDC
tSTAB
tJITCC
t∅
tSKO
tJITPER
tJITHPER
tLSI
tLSO
MIN
60
40
-
-75
-50
-
-75
-100
1.0
1.0
0°C ≤ TA ≤ +70°C
VDD = +2.6V ±0.1V
NOMINAL
-
-
-
-
0
-
-
-
-
-
MAX
220
60
100
75
50
100
75
100
4
2
UNITS
MHz
%
ms
ps
ps
ps
ps
ps
V/ns
V/ns
NOTES
2, 3
4
5
6
6
7
NOTE:
1. The timing and switching specifications for the PLL listed above are critical for proper operation of DDR SDRAM Regis-
tered DIMMs. These are meant to be a subset of the parameters for the specific device used on the module. Detailed
information for this PLL is available in JEDEC Standard JESD82.
2. The PLL must be able to handle spread spectrum induced skew.
3. Operating clock frequency indicates a range over which the PLL must be able to lock, but in which it is not required to
meet the other timing parameters. (Used for low speed system debug.)
4. Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its ref-
erence signal after power up.
5. Static Phase Offset does not include Jitter.
6. Period Jitter and Half-Period Jitter specifications are separate specifications that must be met independently of each
other.
7. The Output Slew Rate is determined from the IBIS model:
VDD
CDCV857
VCK
R=60Ω
R=60Ω VDD/2
VCK
GND
pdf: 09005aef80f6b913, source: 09005aef80f6b41c
DDAF18C64_128x72G.fm - Rev. C 9/04 EN
22
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc. All rights reserved.