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MTA36ASF4G72PZ Datasheet, PDF (1/28 Pages) Micron Technology – DDR4 SDRAM RDIMM
32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
DDR4 SDRAM RDIMM
MTA36ASF4G72PZ – 32GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 288-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC4-2666, PC4-2400, or
PC4-2133
• 32GB (4 Gig x 72)
• VDD = 1.20V (NOM)
• VPP = 2.5V (NOM)
• VDDSPD = 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1: 288-Pin RDIMM (MO-309, R/C-B1)
Module height: 31.25mm (1.23in)
Figure 2: 288-Pin RDIMM (MO-309, R/C-B2)
Module height: 31.25mm (1.23in)
Options
• Operating temperature
– Commercial (0°C ≤ TOPER ≤ 95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.75ns @ CL = 19 (DDR4-2666)
– 0.83ns @ CL = 17 (DDR4-2400)
– 0.93ns @ CL = 15 (DDR4-2133)
Marking
None
Z
-2G6
-2G3
-2G1
Table 1: Key Timing Parameters
Speed
Grade
-2G6
-2G4
-2G3
-2G1
Industry
Nomen-
clature
PC4-2666
PC4-2400
PC4-2400
PC4-2133
CL =
20,
CL =
19
2666
–
–
–
CL =
18
2666
2400
2400
–
CL =
17
2400
2400
2400
–
CL =
16
2133
2400
2133
2133
Data Rate (MT/s)
CL =
15
2133
2133
2133
2133
CL =
14
1866
1866
1866
1866
CL = CL =
13 12
1866 1600
1866 1600
1866 1600
1866 1600
CL =
11
1600
1600
1600
1600
CL =
10
1333
–
1333
–
tRCD tRP
CL = 9 (ns) (ns)
– 14.16 14.16
1333 13.32 13.32
– 14.16 14.16
1333 13.5 13.5
tRC
(ns)
46.16
45.32
46.16
46.5
PDF: 09005aef85e8fa27
asf36c4gx72pz.pdf - Rev. F 8/16 EN
1
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Products and specifications discussed herein are subject to change by Micron without notice.