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MT9VDDT3272AY Datasheet, PDF (1/27 Pages) Micron Technology – DDR SDRAM UNBUFFERED DIMM | |||
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128MB, 256MB, 512MB (x72, ECC, SR), PC3200
184-Pin DDR SDRAM UDIMM
DDR SDRAM
UNBUFFERED DIMM
MT9VDDT1672A â 128MB
MT9VDDT3272A â 256MB
MT9VDDT6472A â 512MB
For the latest data sheet, please refer to the Micron Web
site: www.micron.com/products/modules
Features
⢠JEDEC-standard 184-pin dual in-line memory
module (DIMM)
⢠Fast data transfer rate: PC3200
⢠CAS Latency 3
⢠Utilizes 400 MT/s DDR SDRAM components
⢠Supports ECC error detection and correction
⢠128MB (16 Meg x 72), 256MB (32 Meg x 72), 512MB
(64 Meg x 72)
⢠VDD= VDDQ= +2.6V
⢠VDDSPD = +2.3V to +3.6V
⢠+2.6V I/O (SSTL_2 compatible)
⢠Commands entered on each positive CK edge
⢠DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
⢠Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
⢠Bidirectional data strobe (DQS) transmitted/
received with dataâi.e., source-synchronous data
capture
⢠Differential clock inputs (CK and CK#)
⢠Four internal device banks for concurrent operation
⢠Programmable burst lengths: 2, 4, or 8
⢠Auto precharge option
⢠Auto Refresh and Self Refresh Modes
⢠15.6µs (128MB), 7.8125µs (256MB, 512MB)
maximum average periodic refresh interval
⢠Serial Presence-Detect (SPD) with EEPROM
⢠Programmable READ CAS latency
⢠Gold edge contacts
Figure 1: 184-Pin DIMM (MO-206)
Standard 1.25in. (31.75mm)
OPTIONS
⢠Package
184-pin DIMM (standard)
184-pin DIMM (lead-free)
⢠Frequency/CAS Latency
5ns, 400 MT/s (200 MHz), CL = 3
⢠PCB
1.25in. (31.75mm)
MARKING
G
Y
-40B
None
Table 1: Address Table
Refresh Count
Row Addressing
Device Bank Addressing
Device Configuration
Column Addressing
Module Rank Addressing
128MB
4K
4K (A0âA11)
4 (BA0, BA1)
128Mb (16 Meg x 8)
1K (A0âA9)
1 (S0#)
256MB
8K
8K (A0âA12)
4 (BA0, BA1)
256Mb (32 Meg x 8)
1K (A0âA9)
1 (S0#)
512MB
8K
8K (A0âA12)
4 (BA0, BA1)
512Mb (64 Meg x 8)
2K (A0âA9, A11)
1 (S0#)
pdf: 09005aef80a43e7d, source: 09005aef80a43d77
DDA9C16_32_64x72AG.fm - Rev. B 9/04 EN
1
©2004 Micron Technology, Inc.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.
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