English
Language : 

MT28F1284W18 Datasheet, PDF (1/66 Pages) Micron Technology – 1.8V Low Voltage, Extended Temperature
FLASH MEMORY
8 MEG x 16
ASYNC/PAGE/BURST FLASH MEMORY
MT28F1284W18
1.8V Low Voltage, Extended Temperature
Features
Dedicated commands to decrease programming times for
both in-factory and in-system operations
Fast programming algorithm (FPA) for fast PROGRAM
operation
16-word page
Flexible 8Mb multipartition architecture
Single word (16-bit) data bus
Support for true concurrent operation with zero latency
Basic configuration:
• 135 individually programmable/erasable blocks
• 16 partitions (8Mb each for code and data storage)
Operating Voltage
• VCC = 1.70V (MIN)–1.95V (MAX)
• VCCQ = 1.70V (MIN)–2.24V (MAX)
VPP = 1.8V (TYP) for in-system PROGRAM/ERASE
• 12V ±5% (HV) VPP tolerant (factory programming
compatibility)
Random access time: 60ns @ 1.70V VCC
Burst mode read access
• MAX clock rate: 66 MHz (tCLK = 15ns)
• MAX clock rate: 54 MHz (tCLK = 18.5ns)
• Burst latency 60ns @1.70V VCC and 66 MHz
• 4 word, 8 word, 16 word, and continuous burst modes
• tACLK: 14ns @ 1.70V VCC and 54 MHz
• tACLK: 11ns @ 1.70V VCC and 66 MHz
Page mode read access
• Interpage read access: 60ns @ 1.70V VCC
• Intrapage read access: 15ns @ 1.70V VCC
Low power consumption (VCC = 1.95V)
• Burst read @ 66 MHz <10mA (TYP)
• Standby < 50µA(TYP)
• Automatic power save (APS)
Enhanced program and erase suspend options
• ERASE-SUSPEND-to-READ within same partition
• PROGRAM-SUSPEND-to-READ within same
partition
• ERASE-SUSPEND-to-PROGRAM within same
partition
Dual 64-bit chip protection registers for security purposes
Cross-compatible command support
• Extended command set
• Common flash interface
Programmable WAIT# configuration
Clock suspend
100,000 ERASE cycles per block
Figure 1: 56-Ball VFBGA
1
2
3
4
5
6
7
8
A
A11
A8
VSS
VCC
VPP
A18
A6
A4
B
A12
A9
A20 CLK
RST# A17
A5
A3
C
A13 A10 A21 ADV# WE# A19
A7
A2
D
A15 A14 WAIT# A16 DQ12 WP# A22
A1
E
VCCQ DQ15 DQ6 DQ4 DQ2 DQ1 CE#
A0
F
VSS DQ14 DQ13 DQ11 DQ10 DQ9 DQ0 OE#
G
DQ7 VSSQ DQ5 VCC
DQ3 VCCQ DQ8 VSSQ
Top View
NOTE:
1. See Table 3 for ball descriptions.
2. See Figure 35 for mechanical drawing.
Options
Marking
Timing
• 60ns access
-60
• 70ns access
-70
Burst Frequency
• 54 MHz
5
• 66 MHz1
6
Boot Block Configuration
• Top
T
• Bottom
B
Package
• 56-ball VFBGA (Standard) 7 x 8 ball
FQ
grid
• 56-ball VGBGA (Lead-free) 7 x 8 ball
BQ
grid2
Operating Temperature Range
• Extended (-40ºC to +85ºC)
ET
NOTES: 1. Contact factory for availability.
2. Contact factory for details.
Part Number Example:
MT28F1284W18FQ-705 TET
09005aef80b425b4
MT28F1284W18_D.fm - Rev. D, 11/03 EN
1
©2003 Micron Technology, Inc. All rights reserved.
‡PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.