TC1275_07 Datasheet, PDF (8/12 Pages) Microchip Technology – 3-Pin Reset Monitors for 3.3V Systems

TC1275/TC1276/TC1277
3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
E
E1
1
2
e
e1
D
c
A
A2
φ
A1
L
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
3
Lead Pitch
e
0.95 BSC
Outside Lead Pitch
e1
1.90 BSC
Overall Height
A
0.89
–
1.12
Molded Package Thickness
A2
0.79
0.95
1.02
Standoff
A1
0.01
–
0.10
Overall Width
E
2.10
–
2.64
Molded Package Width
E1
1.16
1.30
1.40
Overall Length
D
2.67
2.90
3.05
Foot Length
L
0.13
0.50
0.60
Foot Angle
φ
0°
–
10°
Lead Thickness
c
0.08
–
0.20
Notes:
Lead Width
b
0.30
–
0.54
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-104B
DS21383C-page 8
© 2007 Microchip Technology Inc.