PL610-02 Datasheet, PDF (7/16 Pages) Microchip Technology – 1.8V to 3.3V Single IC XO with Frequency Tuning (10 MHz to 130 MHz)

PL610-01/-02/-03
2.0 PAD DESCRIPTIONS
The descriptions of the pads are listed in Table 2-2.
Pad Configurations
PL610-01
0.60
(650μmx600μm)
XIN
1
6
XOUT
OE^, PDB^,
CLK1
2 ^PL610-01 5
(Wire Bond)
VDD
GND 3
4 CLK0
X
Y
Note: ^ denotes internal pull up
XOUT
PL610-02
0.60
(650μmx600μm)
1
6
XIN
VDD
2 ^PL610-02 5
(Flip Chip)
OE^, PDB^,
CLK1
CLK0 3
4 GND
X
Y
Note: ^ denotes internal pull up
XIN
PL610-03
0.60
(650μmx600μm)
1
6
XOUT
GND
2 _PL610-03 5
OE^, PDB^,
CLK1
CLK0 3
4 VDD
X
Y
Note: ^ denotes internal pull up
TABLE 2-1: DIE SPECIFICATION
Chip Size
0.65 mm x 0.60 mm
Chip Thickness
Optional
Pad Size
90 µm
TABLE 2-2: PAD FUNCTION TABLE
Pad Number
Pad Center
X
Y
1
–177
231
2
–215
41
3
–215
–186
4
215
–186
5
215
41
6
177
213
Pad Name
PL610-01
XIN
OE, PDB, CLK1
GND
CLK0
VDD
XOUT
Pad Name
PL610-02
XOUT
VDD
CLK0
GND
OE, PDB, CLK1
XIN
Chip Base
GND Level
Pad Name
PL610-03
XIN
GND
CLK0
VDD
OE, PDB, CLK1
XOUT
 2016 Microchip Technology Inc.
DS20005616A-page 7