MIC28303 Datasheet, PDF (6/38 Pages) Microchip Technology – 50V, 3A Power Module

MIC28303
TEMPERATURE SPECIFICATIONS
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Junction Operating Temperature
Storage Temperature Range
Junction Temperature
Lead Temperature
T_J
–40
—
T_S
–65
—
T_J
—
—
—
—
—
+125
+150
+150
+260
°C Note 1
°C —
°C —
°C Soldering, 10s
Package Thermal Resistances
Thermal Resistance 12 mm x 12 mm
_JA
—
20
QFN-64LD
_JC
—
5
—
°C/W —
—
°C/W —
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005464A-page 6
 2016 Microchip Technology Inc.