MIC28303 Datasheet, PDF(19/38 Page) Microchip Technology

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MIC28303 Datasheet, PDF (19/38 Pages) Microchip Technology – 50V, 3A Power Module

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3.0 PIN DESCRIPTIONS

Package Type

MIC28303

64-Pin 12 mm x 12 mm QFN (MP)

MIC28303

GND 1

GND 2

GND 3

ILIM 4

VIN 5

SW 6

FREQ 7

FREQ 8

PGND 9

PGND 10

PGND 11

PGND 12

PGND 13

PVIN 14

PVIN 15

PVIN 16

PVIN 17

PVIN 18

50 ANODE

49 ANODE

48 SW

47 SW

46 SW

45 SW

44 SW

43 SW

42 SW

41 SW

40 SW

39 NC

38 VOUT

37 VOUT

36 VOUT

35 VOUT

34 VOUT

33 VOUT

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin Number

Symbol

Description

1, 2, 3, 54, 64

5, 60

6, 40 to 48, 51

7, 8

9 to 13

14 to 22

23 to 38

GND

ILIM

VIN

FREQ

PGND

PVIN

VOUT

Analog Ground. Ground for internal controller and feedback resistor network. The

analog ground return path should be separate from the power ground (PGND) return

path.

Current Limit Setting. Connect a resistor from SW (Pin 6) to ILIM to set the

overcurrent threshold for the converter.

Supply Voltage for Controller. The VIN operating voltage range is from 4.5V to 50V.

A 0.47 Î¼F ceramic capacitor from VIN (pin 60) to GND is required for decoupling.

Pin 5 should be externally connected to either PVIN or Pin 60 on PCB.

Switch Node and Current-Sense Input. High current output driver return. The SW

pin connects directly to the switch node. Due to the high-speed switching on this

pin, the SW pin should be routed away from sensitive nodes. The SW pin also

senses the current by monitoring the voltage across the low-side MOSFET during

OFF time.

Switching Frequency Adjust Input. Leaving this pin open will set the switching

frequency to 600 kHz. Alternatively, a resistor from this pin to ground can be used

to lower the switching frequency.

Power Ground. PGND is the return path for the buck converter power stage. The

PGND pin connects to the sources of low-side N-Channel external MOSFET, the

negative terminals of input capacitors, and the negative terminals of output

capacitors. The return path for the power ground should be as small as possible

and separate from the analog ground (GND) return path.

Power Input Voltage. Connection to the drain of the internal high-side power

MOSFET.

Output Voltage. Connection with the internal inductor, the output capacitor should

be connected from this pin to PGND as close to the module as possible.

No Connection. Leave it floating.

ï£ 2016 Microchip Technology Inc.

DS20005464A-page 19

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