MIC24051 Datasheet, PDF (6/34 Pages) Micrel Semiconductor – 12V, 6A High-Efficiency Buck Regulator

MIC24051
TEMPERATURE SPECIFICATIONS
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Junction Operating Temperature
Range
Maximum Junction Temperature
Storage Temperature
Lead Temperature
T_J
–40
—
—
—
—
T_S
–65
—
—
—
—
+125
+150
+150
+260
°C Note 1
°C —
°C —
°C Soldering, 10s
Package Thermal Resistances
Thermal Resistance, 5x6 QFN-28
_JA
—
28
—
°C/W Note 2
Thermal Resistance, 5x6 QFN-28
_JC
—
2.5
—
°C/W —
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: P_D(MAX) = (T_J(MAX) – T_A)/_JA, where _JA depends upon the printed circuit layout. A 5 square inch 4 layer,
0.62”, FR-4 PCB with 2 oz. finish copper weight per layer is used for the _JA.
DS20005658A-page 6
 2016 Microchip Technology Inc.