MCP79400_16 Datasheet, PDF (53/62 Pages) Microchip Technology – Battery-Backed I2C Real-Time Clock/Calendar with SRAM and Protected EEPROM

MCP79400/MCP79401/MCP79402
8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN]
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Length
D
Overall Width
E
Exposed Pad Length
D2
Exposed Pad Width
E2
Contact Width
b
Contact Length
L
Contact-to-Exposed Pad
K
MILLIMETERS
MIN
NOM
MAX
8
0.50 BSC
0.70
0.75
0.80
0.00
0.02
0.05
0.20 REF
2.00 BSC
3.00 BSC
1.35
1.40
1.45
1.25
1.30
1.35
0.20
0.25
0.30
0.25
0.30
0.45
0.20
-
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 2 of 2
 2011-2016 Microchip Technology Inc.
DS20005009F-page 53