TC1054_12 Datasheet, PDF(3/20 Page) Microchip Technology – 50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and ERROR Output

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TC1054_12 Datasheet, PDF (3/20 Pages) Microchip Technology – 50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and ERROR Output

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TC1054/TC1055/TC1186

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 ÂµA, CL = 3.3 ÂµF, SHDN > VIH, TA = +25Â°C. Boldface

type specifications apply for junction temperatures of -40Â°C to +125Â°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Dropout Voltage

VIN â VOUT

TC1055; TC1186

TC1186

Supply Current

IIN

Shutdown Supply Current

IINSD

Power Supply Rejection Ratio PSRR

Output Short Circuit Current

IOUTSC

Thermal Regulation

ïVOUT/ïPD

Thermal Shutdown

Die Temperature

TSD

180

270

0.05

300

0.04

160

mV IL = 100 ÂµA

IL = 20 mA

120

IL = 50 m

250

IL = 100 mA

400

IL = 150 mA (Note 4)

ÂµA SHDN = VIH,

IL = 0 ÂµA (Note 9)

0.5

ÂµA SHDN = 0V

dB f ï£ï 1 kHz

450

mA VOUT = 0V

V/W Notes 5, 6

Â°C

Thermal Shutdown Hysteresis

Output Noise

ïTSD

260

Â°C

nV/ïHz IL = IOUTMAX

SHDN Input

SHDN Input High Threshold

VIH

SHDN Input Low Threshold

VIL

%VIN VIN = 2.5V to 6.5V

ERROR Output

Minimum VIN Operating Voltage VINMIN

1.0

Output Logic Low Voltage

VOL

400

mV 1 mA Flows to ERROR

ERROR Threshold Voltage

VTH

0.95 x VR

V See Figure 4-2

ERROR Positive Hysteresis

VHYS

mV Note 7

VOUT to ERROR Delay

tDELAY

2.5

ms VOUT falling from

VR to VR â 10%

Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V,

4.0V, 5.0V.

2: TC VOUT = (VOUTMAX â VOUTMIN)x 106

VOUT x ïT

3: Regulation is measured at a constant junction temperature using low-duty-cycle pulse testing. Load regu-

lation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output

voltage due to heating effects are covered by the thermal regulation specification.

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its

nominal value.

5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipa-

tion is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX

at VIN = 6V for T = 10 ms.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, ï±JA). Exceeding the

maximum allowable power dissipation causes the device to initiate thermal shutdown. See Section 5.0

âThermal Considerationsâ for more details.

7: Hysteresis voltage is referenced by VR.

8: The minimum VIN has to justify the conditions: VIN ï³ VR + VDROPOUT and VIN ï³ 2.7V for IL = 0.1 mA to

IOUTMAX.

9: Apply for junction temperatures of -40Â°C to +85Â°C.

ï£ 2002-2012 Microchip Technology Inc.

DS21350E-page 3

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