DSPIC30F5015_11 Datasheet, PDF (178/234 Pages) Microchip Technology – High-Performance, 16-bit Digital Signal Controllers

dsPIC30F5015/5016
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5015
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC30F5015-30I
dsPIC30F5015-20E
4.5-5.5
-40 to +85
30
—
4.5-5.5
-40 to +125
—
20
3.0-3.6
-40 to +85
20
—
3.0-3.6
-40 to +125
—
15
2.5-3.0
-40 to +85
10
—
TABLE 24-2: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5016
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC30F5016-30I
dsPIC30F5016-20E
4.5-5.5
-40 to +85
30
—
4.5-5.5
-40 to +125
—
20
3.0-3.6
-40 to +85
20
—
3.0-3.6
-40 to +125
—
15
2.5-3.0
-40 to +85
10
—
TABLE 24-3: THERMAL OPERATING CONDITIONS FOR dsPIC30F5015/5016
Rating
Symbol Min
Typ
Max Unit
dsPIC30F5015-30I/dsPIC30F5016-30I
Operating Junction Temperature Range
Operating Ambient Temperature Range
dsPIC30F5015-20E/dsPIC30F5016-20E
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
∑ ^PINT
=
VDD ×
⎛
⎝
IDD
–
IO
⎞
H_⎠
I/O Pin Power Dissipation:
∑ ∑ ^{PI/O = ({VDD – VOH}× IOH ) + (VOL × I OL)}
Maximum Allowed Power Dissipation
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+150
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
TABLE 24-4: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
θJA
39
—
°C/W
1
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
θJA
39
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
DS70149E-page 178
© 2011 Microchip Technology Inc.