MRF24J40MD Datasheet, PDF (17/34 Pages) Microchip Technology – 2.4 GHz IEEE Std. 802.15.4™ RF Transceiver Module with PA/LNA

2.4 Printed Circuit Board
The MRF24J40MD/ME module PCB is constructed
with high temperature FR4 material, four layers and
0.032 " thick. The layers are illustrated in Figure 2-6
through Figure 2-10. The stack up of the PCB is
illustrated in Figure 2-11.
FIGURE 2-6:
TOP SILK SCREEN
MRF24J40MD/ME
FIGURE 2-8:
LAYER 2 – GROUND
PLANE
FIGURE 2-7:
TOP COPPER
FIGURE 2-9:
LAYER 3 – POWER
PLANE
 2014 Microchip Technology Inc.
Advance Information
DS70005173A-page 17