24AA128_07 Datasheet, PDF (17/26 Pages) Microchip Technology – 128K I2C CMOS Serial EEPROM

24AA128/24LC128/24FC128
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
12
e
b
c
A
A2
φ
A1
L1
L
Number of Pins
Pitch
Units
Dimension Limits
N
e
MILLIMETERS
MIN
NOM
MAX
8
0.65 BSC
Overall Height
Molded Package Thickness
Standoff
A
–
–
1.10
A2
0.75
0.85
0.95
A1
0.00
–
0.15
Overall Width
Molded Package Width
Overall Length
E
4.90 BSC
E1
3.00 BSC
D
3.00 BSC
Foot Length
L
0.40
0.60
0.80
Footprint
L1
0.95 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.08
–
0.23
Notes:
Lead Width
b
0.22
–
0.40
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
DS21191P-page 17