24AA128_07 Datasheet, PDF (15/26 Pages) Microchip Technology – 128K I2C CMOS Serial EEPROM

24AA128/24LC128/24FC128
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
12
e
b
α
c
A
A2
φ
β
A1
L
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
1.77
–
2.03
Molded Package Thickness
A2
1.75
–
1.98
Standoff §
A1
0.05
–
0.25
Overall Width
E
7.62
–
8.26
Molded Package Width
E1
5.11
–
5.38
Overall Length
D
5.13
–
5.33
Foot Length
L
0.51
–
0.76
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.15
–
0.25
Lead Width
b
0.36
–
0.51
Mold Draft Angle Top
α
–
–
15°
Notes:
Mold Draft Angle Bottom
β
–
–
15°
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Microchip Technology Drawing C04-056B
© 2007 Microchip Technology Inc.
DS21191P-page 15