EQCO30T5.2 Datasheet, PDF (16/22 Pages) Microchip Technology – EQCO30T5.2 3G/HD-SDI Video Cable Driver

EQCO30T5.2
16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
16
1
2
C2 Y2
E
G1
X1
Y1
SILK SCREEN
RECOMMENDED LAND PATTERN
Notes:
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X16)
X1
Contact Pad Length (X16)
Y1
Contact Pad to Center Pad (X16) G1
MILLIMETERS
MIN
NOM
MAX
0.65 BSC
2.15
2.15
3.625
3.625
0.30
0.725
0.20
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2259A
DS60001303C-page 16
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