EQCO30T5.2 Datasheet, PDF (10/22 Pages) Microchip Technology – EQCO30T5.2 3G/HD-SDI Video Cable Driver

EQCO30T5.2
2.2 EQCO30T5 in Bidirectional Link (Including Power Supply)
FIGURE 2-3:
EQCO30T5 IN BIDIRECTIONAL LINK (INCLUDING POWER SUPPLY
TRANSMISSION)
Resistors R8 and R9 are to be placed close to pins 12
and 11, respectively. From there onwards, the traces up
to the coax connector SDIP1 should be laid out as 75Ω
traces (including the C3 and C4 capacitors as AC cou-
plers). Resistor R1 has to be placed very close to this
coax connector with a very short, low-impedance con-
nection between one of the shielding pins of the con-
nector and the resistor. To achieve the return-loss
illustrated in the appendix, the power and ground
planes below components FB1, FB2, R3, R4, L1, R5,
L2 should be removed (applying cut-outs).
2.2.1 COMPONENT RECOMMENDATION
When using the components below, a maximum cur-
rent of 900 mA can be communicated to power-up the
camera side. Different types of inductors may be suit-
able in order to allow a higher current level, however,
the RF quality of the inductor should be checked.
Ferrite Beads Fb1, Fb2 = FBMH1608HM102 from
Taiyo Yuden
Inductor L1= 1812PS_103 from Coilcraft
DS60001303C-page 10
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